Invention Grant
- Patent Title: Thin film type chip device and method for manufacturing the same
- Patent Title (中): 薄膜型芯片装置及其制造方法
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Application No.: US14078033Application Date: 2013-11-12
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Publication No.: US09042106B2Publication Date: 2015-05-26
- Inventor: Geon Se Chang , Sung Kwon Wi , Yong Suk Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0128154 20121113
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H01F17/00 ; H05K3/00
Abstract:
Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.
Public/Granted literature
- US20140133107A1 THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-05-15
Information query
