Invention Grant
- Patent Title: Techniques for connected component labeling
- Patent Title (中): 连接组件标签技术
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Application No.: US13666913Application Date: 2012-11-01
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Publication No.: US09042652B2Publication Date: 2015-05-26
- Inventor: Niraj Gupta , Oren Agam , Benny Eitan , Mostafa Hagog
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak Bluni PLLC
- Main IPC: G06K9/34
- IPC: G06K9/34 ; G06K9/46 ; G06T7/00

Abstract:
An apparatus may include a memory, a processor circuit, and a connected component labeling module. The connected component labeling module may be operative of the processor circuit to determine one or more connected components during reading of an image comprising a multiplicity of pixels from the memory, assign a label to a plurality of pixels of the multiplicity of pixels, generate one or more label connections for a respective one or more labels, each label connection linking a higher label to a lowest label for the same connected component, and write to the memory for each label of the one or more labels a lowest label as defined by the label connection for the each label after a label is assigned to each pixel.
Public/Granted literature
- US20140119657A1 EFFICIENT IMAGE ANALYSIS APPARATUS AND TECHNIQUE Public/Granted day:2014-05-01
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