Invention Grant
- Patent Title: Optical waveguide platform with hybrid-integrated optical transmission device and optical active device and method of manufacturing the same
- Patent Title (中): 具有混合集成光传输装置和光学有源装置的光波导平台及其制造方法
-
Application No.: US13487807Application Date: 2012-06-04
-
Publication No.: US09042686B2Publication Date: 2015-05-26
- Inventor: Hyun Soo Kim , Jong Sool Jeong , Mi-Ran Park , Byungseok Choi , O-Kyun Kwon
- Applicant: Hyun Soo Kim , Jong Sool Jeong , Mi-Ran Park , Byungseok Choi , O-Kyun Kwon
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2011-0139138 20111221
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/26 ; G02B6/42 ; G02B6/10 ; G02B6/43 ; G02B6/122

Abstract:
Disclosed are an optical waveguide platform with integrated active transmission device and monitoring photodiode. The optical waveguide platform with hybrid integrated optical transmission device and optical active device includes an optical waveguide region formed by stacking a lower cladding layer, a core layer and an upper cladding layer on a substrate; a trench region formed by etching a portion of the optical waveguide region; and a spot expanding region formed on the core layer in the optical waveguide region, in which the optical transmission device is mounted in the trench region and the optical active device is flip-chip bonded to the spot expanding region. The monitoring photodiode is flip-chip bonded to the spot expanding region of the core layer of the optical waveguide, thereby monitoring output light including an optical coupling loss that occurs during flip-chip bonding.
Public/Granted literature
Information query