Invention Grant
- Patent Title: Optical coupling module for silicon photonics chip
- Patent Title (中): 硅光电芯片光耦合模块
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Application No.: US14081197Application Date: 2013-11-15
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Publication No.: US09042691B2Publication Date: 2015-05-26
- Inventor: Sae-Kyoung Kang , Sang-Soo Lee
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon-si
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon-si
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2012-0139064 20121203
- Main IPC: G02B6/34
- IPC: G02B6/34 ; G02B6/293 ; G02B6/122 ; G02B6/30 ; G02B6/12

Abstract:
An optical coupling module for a silicon photonics chip in which a grating is formed on an optical waveguide, and a material having an intermediate refractive index between refractive indexes of a core and a cladding for side surface optical coupling of the silicon photonics chip is provided. The optical coupling module which is optically coupled with an internal/external optical fiber comprises a core transmitting light, and a cladding covering the core and holding the light in the core through total internal reflection, wherein a grating is formed at one end of the core, and a refractive element is formed between the one end of the core and the cladding, has an intermediate refractive index between the refractive indexes of the core and the cladding, and is optically coupled with the internal/external optical fiber.
Public/Granted literature
- US20140153873A1 OPTICAL COUPLING MODULE FOR SILICON PHOTONICS CHIP Public/Granted day:2014-06-05
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