Invention Grant
- Patent Title: Fabrication of a magnetic tunnel junction device
- Patent Title (中): 磁隧道结装置的制造
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Application No.: US14048918Application Date: 2013-10-08
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Publication No.: US09043740B2Publication Date: 2015-05-26
- Inventor: Kangho Lee , Xiaochun Zhu , Xia Li , Seung Hyuk Kang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Donald D. Min
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L43/02 ; B82Y25/00 ; B82Y40/00 ; H01F10/32 ; H01F41/30 ; H01F41/32 ; H01L43/08 ; H01L43/12 ; H01L27/22

Abstract:
A magnetic tunneling junction device and fabrication method is disclosed. In a particular embodiment, a non-transitory computer-readable medium includes processor executable instructions. The instructions, when executed by a processor, cause the processor to initiate deposition of a capping material on a free layer of a magnetic tunneling junction structure to form a capping layer. The instructions, when executed by the processor, cause the processor to initiate oxidization of a first layer of the capping material to form a first oxidized layer of oxidized material.
Public/Granted literature
- US20140038312A1 FABRICATION OF A MAGNETIC TUNNEL JUNCTION DEVICE Public/Granted day:2014-02-06
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