Invention Grant
- Patent Title: Wiring harness
- Patent Title (中): 线束
-
Application No.: US13634644Application Date: 2011-02-07
-
Publication No.: US09045092B2Publication Date: 2015-06-02
- Inventor: Eiichi Toyama , Shigemi Hashizawa , Tatsuya Oga , Hidehiro Ichikawa
- Applicant: Eiichi Toyama , Shigemi Hashizawa , Tatsuya Oga , Hidehiro Ichikawa
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2010-059108 20100316
- International Application: PCT/JP2011/052510 WO 20110207
- International Announcement: WO2011/114801 WO 20110922
- Main IPC: H02G3/04
- IPC: H02G3/04 ; B60R16/02 ; H02G3/32
Abstract:
A wiring harness includes: a harness main body having a plurality of high voltage electrically conductive paths; and a half pipe as a harness attachment member. The half pipe is formed in a substantially roof gutter shape. The half pipe is provided on a cabling target portion of a vehicle floor where the harness main body is cabled and fixed to the vehicle floor with the substantially roof gutter shape.
Public/Granted literature
- US20130008710A1 WIRING HARNESS Public/Granted day:2013-01-10
Information query
IPC分类:
