发明授权
US09046766B2 Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using same
有权
光化感光或辐射敏感树脂组合物和使用其的图案形成方法
- 专利标题： Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using same
- 专利标题（中）： 光化感光或辐射敏感树脂组合物和使用其的图案形成方法
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申请号： US12499515申请日： 2009-07-08
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公开(公告)号： US09046766B2公开(公告)日： 2015-06-02
- 发明人: Takayuki Kato , Michihiro Shirakawa , Hyou Takahashi
- 申请人： Takayuki Kato , Michihiro Shirakawa , Hyou Takahashi
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM Corporation
- 当前专利权人： FUJIFILM Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2008-179228 20080709; JP2009-146250 20090619
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/30 ; C07C303/32 ; C07C309/04 ; C07C309/06 ; C07C309/12 ; C07C309/13 ; C07C309/19 ; G03F7/039 ; G03F7/20 ; G03F7/11
摘要：
An actinic ray-sensitive or radiation-sensitive resin composition comprises (A) a resin that exhibits an increased solubility in an alkali developer when acted on by an acid, and (B) at least two types of sulfonic acid generators that generate a sulfonic acid when exposed to actinic rays or radiation, wherein the two types of sulfonic acid generators (B) consist of sulfonic acid generators (B1) and (B2) satisfying the following requirements, namely the sulfonic acid generator (B1) generates a sulfonic acid composed of 9 to 20 elements with an acid strength (pKa) satisfying the relationship pKa pKa≧−3.50, provided that no hydrogen atom is included in the number of elements of the generated acids.