发明授权
- 专利标题: Method for shaping a laminate substrate
- 专利标题(中): 层压基板成型方法
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申请号: US13488678申请日: 2012-06-05
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公开(公告)号: US09048245B2公开(公告)日: 2015-06-02
- 发明人: Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
- 申请人: Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Steven Meyers; L. Jeffrey Kelly
- 主分类号: B23K31/00
- IPC分类号: B23K31/00 ; B23K31/02 ; B23K1/00 ; B23K1/008 ; B23K1/19 ; B23K37/00 ; B23K37/04 ; H01L23/00 ; H01L21/673
摘要:
A method including providing a fixture comprising a trap ring, a base plate having a recess adapted to receive a laminate substrate, the base plate including an opening and an adjustable height center button disposed in the opening, the opening being located within the recess and located in a center of the laminate substrate, characterizing the laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into the fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by the adjustable height center button, wherein the adjustable height center button contacts the laminate substrate. The method further includes fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.
公开/授权文献
- US20130320069A1 METHOD FOR SHAPING A LAMINATE SUBSTRATE 公开/授权日:2013-12-05