Invention Grant
- Patent Title: Integrated circuit package assembly including wave guide
- Patent Title (中): 集成电路封装组件,包括波导
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Application No.: US13435362Application Date: 2012-03-30
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Publication No.: US09048248B2Publication Date: 2015-06-02
- Inventor: Linus Maurer , Alexander Reisenzahn , Markus Treml , Thomas Wickgruber
- Applicant: Linus Maurer , Alexander Reisenzahn , Markus Treml , Thomas Wickgruber
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01Q1/00
- IPC: H01Q1/00 ; H01L23/66 ; H01P5/107 ; H01Q1/22 ; H01Q1/52 ; H01Q9/04 ; H01Q13/06

Abstract:
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
Public/Granted literature
- US20120187511A1 INTEGRATED CIRCUIT PACKAGE ASSEMBLY INCLUDING WAVE GUIDE Public/Granted day:2012-07-26
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