Invention Grant
- Patent Title: Sealed body, light-emitting module and method of manufacturing sealed body
- Patent Title (中): 密封体，发光模块及密封体的制造方法
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Application No.: US13686252Application Date: 2012-11-27
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Publication No.: US09048350B2Publication Date: 2015-06-02
- Inventor: Yusuke Nishido
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2011-259289 20111128
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L33/00 ; H01L23/28 ; H01L23/29 ; H01L33/56 ; H01L51/52 ; H01L51/56
Abstract:
A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate.
Public/Granted literature
- US20130134570A1 Sealed Body, Light-Emitting Module and Method of Manufacturing Sealed Body Public/Granted day:2013-05-30
Information query
IPC分类:
