发明授权
US09053874B2 MEMS switches and other miniaturized devices having encapsulating enclosures, and processes for fabricating same 有权
MEMS开关和具有封装外壳的其它小型化器件及其制造方法

MEMS switches and other miniaturized devices having encapsulating enclosures, and processes for fabricating same
摘要:
Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).
信息查询
0/0