发明授权
- 专利标题： Hot press device and multi-layered printed board press method
- 专利标题（中）： 热压装置和多层印刷板印刷方法
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申请号： US13329589申请日： 2011-12-19
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公开(公告)号： US09055704B2公开(公告)日： 2015-06-09
- 发明人: Kouji Kose , Kouta Togawa , Katsuro Kawazoe , Takayoshi Kojima
- 申请人： Kouji Kose , Kouta Togawa , Katsuro Kawazoe , Takayoshi Kojima
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Volpe and Koenig, P.C.
- 优先权： JP2010-282698 20101220
- 主分类号： B30B7/02
- IPC分类号： B30B7/02 ; H05K3/46
摘要：
A hot press device manufacturing a multilayered printed board by pressing processed members laminated by mutually opposing heating plates includes: a plurality of heating plates including a plurality of projected parts and punched parts engaging therewith and capable of moving in a direction in which the processed members are laminated; and a pressure mechanism pressurizing each of the heating plates in the lamination direction, wherein the processed member is arranged between the heating plates and is pressed by the heating plates pressurized by the pressure mechanism while engaged with each other.
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