Invention Grant
- Patent Title: Subfloor component and method of manufacturing same
- Patent Title (中): 底板构件及其制造方法
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Application No.: US14456053Application Date: 2014-08-11
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Publication No.: US09057196B2Publication Date: 2015-06-16
- Inventor: Victor Amend
- Applicant: Victor Amend
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: E04C1/00
- IPC: E04C1/00 ; E04F15/02 ; E04F15/10 ; E04B1/66 ; B05D1/02 ; B32B38/10 ; E04F15/18 ; B32B37/12 ; B32B38/00

Abstract:
A subfloor component includes a hardboard panel having first and second opposing faces and a plurality of intersecting grooves to define, in cross-section, a plurality of pedestals having walls that extend into the panel from the first face toward the second face. The subfloor component also includes a film of substantially moisture-impervious material attached to the first face of the panel and that conforms to the tops and walls of the pedestals and to the bottoms of the grooves.
Public/Granted literature
- US20140345222A1 SUBFLOOR COMPONENT AND METHOD OF MANUFACTURING SAME Public/Granted day:2014-11-27
Information query
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