发明授权
US09059145B2 Power module, method for manufacturing power module, and molding die
有权
电源模块，电源模块制造方法和成型模具
- 专利标题： Power module, method for manufacturing power module, and molding die
- 专利标题（中）： 电源模块，电源模块制造方法和成型模具
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申请号： US13590707申请日： 2012-08-21
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公开(公告)号： US09059145B2公开(公告)日： 2015-06-16
- 发明人: Takuya Kadoguchi , Yoshikazu Suzuki , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
- 申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
- 申请人地址： JP Toyota-Shi JP Kariya-Shi
- 专利权人： TOYOTA JIDOSHA KABUSHIKI KAISHA,DENSO CORPORATION
- 当前专利权人： TOYOTA JIDOSHA KABUSHIKI KAISHA,DENSO CORPORATION
- 当前专利权人地址： JP Toyota-Shi JP Kariya-Shi
- 代理机构： Kenyon & Kenyon LLP
- 优先权： JP2011-184080 20110825; JP2012-130772 20120608
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01L23/433 ; H01L23/051 ; H01L25/07 ; H01L23/473 ; H01L23/31 ; H01L21/56
摘要：
A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.
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