发明授权
- 专利标题： Leadframe pocket
- 专利标题（中）： 引线框口袋
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申请号： US13932756申请日： 2013-07-01
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公开(公告)号： US09059154B2公开(公告)日： 2015-06-16
- 发明人: David Meadowcroft , Seng-Kum Chan , Matt Murphy
- 申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
- 申请人地址： SG Singapore
- 专利权人： Avago Technologies General IP (Singapore) Pte. Ltd.
- 当前专利权人： Avago Technologies General IP (Singapore) Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L25/16 ; H01L23/34
摘要：
A package structure and methods of manufacturing the same are disclosed. The package structure corresponds, in one example, to a transceiver module having a substrate with a pocket formed therein. The pocket is configured to receive one or multiple parts of a leadframe and helps reduce the amount of wire bonding required to connect the leadframe or components mounted thereon to traces on the substrate.
公开/授权文献
- US20150001693A1 LEADFRAME POCKET 公开/授权日：2015-01-01
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