Invention Grant
- Patent Title: Array substrate and its manufacturing method
- Patent Title (中): 阵列基板及其制造方法
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Application No.: US13967536Application Date: 2013-08-15
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Publication No.: US09059293B2Publication Date: 2015-06-16
- Inventor: Tao Gao , Zhijun Lv , Tailiang Li
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201210295913 20120817
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/12

Abstract:
An array substrate comprises a substrate, a gate electrode, a source electrode and a drain electrode, the source electrode and the drain electrode being provided in different areas on the substrate and the vertical projections of the source electrode and the drain electrode on the substrate having an overlapping area; a semiconductor layer formed between the source electrode and the drain electrode, a vertical projection of the semiconductor layer on the substrate having overlapping areas with the vertical projections of the source electrode and the drain electrode on the substrate; a first insulating layer formed on the substrate while below the gate electrode and covering the source electrode or the drain electrode; a pixel electrode, a gate line, and a data line. A manufacturing method for the array substrate is also disclosed.
Public/Granted literature
- US20140048826A1 ARRAY SUBSTRATE AND ITS MANUFACTURING METHOD Public/Granted day:2014-02-20
Information query
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