发明授权
US09059317B2 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
有权
制造具有叠层在互连层堆叠上的液晶聚合物焊料掩模的电子器件及其相关器件的方法
- 专利标题： Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
- 专利标题（中）： 制造具有叠层在互连层堆叠上的液晶聚合物焊料掩模的电子器件及其相关器件的方法
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申请号： US14162959申请日： 2014-01-24
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公开(公告)号： US09059317B2公开(公告)日： 2015-06-16
- 发明人: Louis Joseph Rendek, Jr. , Michael Raymond Weatherspoon , Casey Philip Rodriguez , David Nicol
- 申请人： HARRIS CORPORATION
- 申请人地址： US FL Melbourne
- 专利权人： HARRIS CORPORATION
- 当前专利权人： HARRIS CORPORATION
- 当前专利权人地址： US FL Melbourne
- 代理机构： Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L25/065 ; H05K1/03 ; H05K3/28 ; H05K3/34
摘要：
A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.
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