发明授权
- 专利标题: Wiring board and method of manufacturing the same
- 专利标题(中): 接线板及其制造方法
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申请号: US13604833申请日: 2012-09-06
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公开(公告)号: US09060455B2公开(公告)日: 2015-06-16
- 发明人: Hitoshi Kondo
- 申请人: Hitoshi Kondo
- 申请人地址: JP Nagano-shi, Nagano
- 专利权人: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址: JP Nagano-shi, Nagano
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2011-198564 20110912
- 主分类号: H05K3/38
- IPC分类号: H05K3/38 ; H05K3/40 ; H05K3/46 ; H01L23/498 ; H01L21/48 ; H05K3/20
摘要:
A wiring board includes: a first wiring layer; a first insulating layer formed on the first wiring layer and including a reinforcing material therein, the first insulating layer having a first opening; a contact layer formed on the first insulating layer and having a second opening communicated with the first opening; and a second wiring layer comprising a second via and a second wiring pattern connected to the second via. The second wiring pattern is formed on the contact layer, and the second via is filled in the first and second openings. An adhesion property between the contact layer and the second wiring pattern is higher than that between the first insulating layer and the second wiring pattern, and a thickness of the contact layer is smaller than that of the first insulating layer.
公开/授权文献
- US20130062108A1 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 公开/授权日:2013-03-14