Invention Grant
US09061397B2 Diamond film for cutting-tools 有权
金刚石薄膜切割工具

Diamond film for cutting-tools
Abstract:
There is provided a diamond film for cutting-tools which has high toughness, excellent adhesiveness, high hardness, and in which tool service life is considerably improved in relation to cutting ultra-hard alloys and other very hard work materials. A diamond film for cutting-tools formed on a base material, in which at least one or more multilayered film layers [A] are included in which the layers are constituted by layering a film layer [α] having a film thickness of 1 μm or more and 15 μm or less and a film layer [β] having a film thickness of 1 μm or more and 20 μm or less so that the film layer [α] is disposed on the base material side and the film layer [β] is disposed on the surface layer side; the film thickness of the entire film body is set to 4 μm or more and 30 μm or less; and the film layer [α] and the film layer [β] have predetermined film compositions.
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