Invention Grant
- Patent Title: Diamond film for cutting-tools
- Patent Title (中): 金刚石薄膜切割工具
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Application No.: US13854573Application Date: 2013-04-01
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Publication No.: US09061397B2Publication Date: 2015-06-23
- Inventor: Akira Sato , Yuji Watanabe , Tetsutaro Ohori , Shuntaro Suzuki , Kazutaka Sato
- Applicant: UNION TOOL CO.
- Applicant Address: JP Tokyo
- Assignee: UNION TOOL CO.
- Current Assignee: UNION TOOL CO.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-129664 20120607
- Main IPC: C23C16/27
- IPC: C23C16/27 ; B24D3/00

Abstract:
There is provided a diamond film for cutting-tools which has high toughness, excellent adhesiveness, high hardness, and in which tool service life is considerably improved in relation to cutting ultra-hard alloys and other very hard work materials. A diamond film for cutting-tools formed on a base material, in which at least one or more multilayered film layers [A] are included in which the layers are constituted by layering a film layer [α] having a film thickness of 1 μm or more and 15 μm or less and a film layer [β] having a film thickness of 1 μm or more and 20 μm or less so that the film layer [α] is disposed on the base material side and the film layer [β] is disposed on the surface layer side; the film thickness of the entire film body is set to 4 μm or more and 30 μm or less; and the film layer [α] and the film layer [β] have predetermined film compositions.
Public/Granted literature
- US20130330529A1 DIAMOND FILM FOR CUTTING-TOOLS Public/Granted day:2013-12-12
Information query
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