Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
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Application No.: US14083440Application Date: 2013-11-18
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Publication No.: US09063389B2Publication Date: 2015-06-23
- Inventor: Jae Ho Baik , Jung Seok Lee , Myung Ki Lee , Jae Hyuk Lee , Po Chul Kim , Woon Ki Kim , Chuel Jin Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2013-0080290 20130709
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G03B3/10
Abstract:
There is provided a camera module including: a lens barrel having one or more lenses positioned along an optical axis; and a housing having the lens barrel therein, wherein the housing includes a first through hole into which the lens barrel is inserted and a second through hole having a diameter larger than that of the first through hole.
Public/Granted literature
- US20150015770A1 CAMERA MODULE Public/Granted day:2015-01-15
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