发明授权
- 专利标题: Multilayer ceramic electronic component and board for mounting the same
- 专利标题(中): 多层陶瓷电子部件和板用于安装
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申请号: US13952573申请日: 2013-07-26
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公开(公告)号: US09064639B2公开(公告)日: 2015-06-23
- 发明人: Byung Woo Han , Dae Bok Oh , Jae Yeol Choi , Sang Huk Kim
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon, Gyunggi-do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon, Gyunggi-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2013-0046769 20130426
- 主分类号: H01G4/12
- IPC分类号: H01G4/12 ; H01G4/30 ; H01G2/06 ; H05K1/18
摘要:
There is provided a multilayer ceramic electronic component includes: a ceramic body including dielectric layers stacked therein and satisfying T(thickness)/W(width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body, having the dielectric layer disposed therebetween, and alternately exposed through end surfaces of the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to upper and lower main surfaces of the ceramic body wherein, when a height of the ceramic body is defined as a, and a distance from an upper end of the first or second external electrode formed on the upper main surface of the ceramic body to a lower end of the first or second external electrode formed on the lower main surface of the ceramic body is defined as b, 0.990≦a/b
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