发明授权
US09064821B2 Silicon dot formation by self-assembly method and selective silicon growth for flash memory
有权
通过自组装方法形成硅点,并对闪存进行选择性硅生长
- 专利标题: Silicon dot formation by self-assembly method and selective silicon growth for flash memory
- 专利标题(中): 通过自组装方法形成硅点,并对闪存进行选择性硅生长
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申请号: US13974137申请日: 2013-08-23
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公开(公告)号: US09064821B2公开(公告)日: 2015-06-23
- 发明人: Chih-Ming Chen , Tsung-Yu Chen , Cheng-Te Lee , Szu-Yu Wang , Chung-Yi Yu , Chia-Shiung Tsai , Xiaomeng Chen
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co. Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co. Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Eschweiler & Associates, LLC
- 主分类号: H01L21/32
- IPC分类号: H01L21/32 ; H01L21/28 ; H01L29/66 ; H01L21/8239 ; H01L21/3213 ; H01L21/3205 ; H01L21/02
摘要:
Some embodiments of the present disclosure relate to a method that achieves a substantially uniform pattern of discrete storage elements within a memory cell. A copolymer solution comprising first and second polymer species is spin-coated onto a surface of a substrate and subjected to self-assembly into a phase-separated material comprising a regular pattern of micro-domains of the second polymer species within a polymer matrix comprising the first polymer species. The second polymer species is then removed resulting with a pattern of holes within the polymer matrix. An etch is then performed through the holes utilizing the polymer matrix as a hard-mask to form a substantially identical pattern of holes in a dielectric layer disposed over a seed layer disposed over the substrate surface. Epitaxial deposition onto the seed layer then utilized to grow a substantially uniform pattern of discrete storage elements within the dielectric layer.
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