发明授权
- 专利标题： Zero stand-off bonding system and method
- 专利标题（中）： 零对接键合系统和方法
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申请号： US13762754申请日： 2013-02-08
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公开(公告)号： US09064880B2公开(公告)日： 2015-06-23
- 发明人: Chun-Hung Lin , Ming-Che Ho , Yu-Feng Chen , Yi-Wen Wu , Hsien-Liang Meng , Han-Ping Pu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L23/00 ; H01L23/31 ; H01L25/10
摘要：
A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.
公开/授权文献
- US20140183746A1 Zero Stand-Off Bonding System and Method 公开/授权日：2014-07-03
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