发明授权
- 专利标题： Support method, high-temperature treatment method using same, and support jig
- 专利标题（中）： 支撑方法，采用高温处理方法，支撑夹具
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申请号： US13404254申请日： 2012-02-24
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公开(公告)号： US09064915B2公开(公告)日： 2015-06-23
- 发明人: Atsushi Kubo , Hirofumi Imai , Koki Tamura , Takahiro Yoshioka
- 申请人： Atsushi Kubo , Hirofumi Imai , Koki Tamura , Takahiro Yoshioka
- 申请人地址： JP Kawasaki-Shi
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kawasaki-Shi
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： JP2011-042954 20110228
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/673 ; H01L21/687
摘要：
A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support.