发明授权
- 专利标题： Methods of forming ultra thin package structures including low temperature solder and structures formed therby
- 专利标题（中）： 形成包括低温焊料和结构在内的超薄封装结构的方法
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申请号： US13721329申请日： 2012-12-20
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公开(公告)号： US09064971B2公开(公告)日： 2015-06-23
- 发明人: Sriram Srinivasan , Ram S. Viswanath , Paul R. Start , Rajen S. Sidhu , Rajasekaran Swaminathan
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H01L29/40
- IPC分类号： H01L29/40 ; H01L23/00 ; H01L23/498
摘要：
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.
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