Invention Grant
- Patent Title: Circuit module
- Patent Title (中): 电路模块
-
Application No.: US14275788Application Date: 2014-05-12
-
Publication No.: US09065539B2Publication Date: 2015-06-23
- Inventor: Tetsuo Saji , Hiroshi Nakamura
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2013-225219 20131030
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04B1/40 ; H04W88/10

Abstract:
A circuit module includes: an RFIC that has a transceiver circuit for processing high-frequency signals related to mobile phone communication and a reception circuit for processing reception signals related to GPS, which is a satellite positioning system; GPS front end components; and mobile phone front end components. The mobile phone front end components are mounted on one main surface of a circuit substrate, and at least one of the GPS front end components (a second band-pass filter) is embedded in the circuit substrate.
Public/Granted literature
- US20150119104A1 CIRCUIT MODULE Public/Granted day:2015-04-30
Information query