Invention Grant
- Patent Title: Microphone assembly
- Patent Title (中): 麦克风组合
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Application No.: US14189795Application Date: 2014-02-25
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Publication No.: US09065990B2Publication Date: 2015-06-23
- Inventor: Atsushi Matsumoto , Norio Matsuura
- Applicant: TEAC Corporation
- Applicant Address: JP Tama-shi, Tokyo
- Assignee: TEAC Corporation
- Current Assignee: TEAC Corporation
- Current Assignee Address: JP Tama-shi, Tokyo
- Agency: Seed IP Law Group PLLC
- Priority: JP2013-181960 20130903
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G03B17/56 ; H04R1/02 ; H04R1/08

Abstract:
A microphone assembly includes a microphone unit and an attachment unit. The attachment unit includes a camera shoe attachment section to be attached to a camera shoe and a damper housing cylinder fixed to the camera shoe attachment section. A holder is fixed to a lower end of an inner cylinder of a protruding section protruding from the microphone unit. The lower end of the inner cylinder is pivotally supported by a second damper contained in the damper housing cylinder through the holder. The middle portion of the protruding section is supported by a first damper contained in the damper housing cylinder.
Public/Granted literature
- US20150062425A1 MICROPHONE ASSEMBLY Public/Granted day:2015-03-05
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