Invention Grant
- Patent Title: IP protection
- Patent Title (中): 知识产权保护
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Application No.: US13161514Application Date: 2011-06-16
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Publication No.: US09069923B2Publication Date: 2015-06-30
- Inventor: Soon Yoeng Tan , Teck Jung Tang , Ian D. Melville , Yelei Vianna Yao , Yasushi Yamagata
- Applicant: Soon Yoeng Tan , Teck Jung Tang , Ian D. Melville , Yelei Vianna Yao , Yasushi Yamagata
- Applicant Address: SG Singapore US NY New York JP
- Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.,INTERNATIONAL BUSINESS MACHINES CORPORATION,RENESAS ELECTRONICS CORPORATION
- Current Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.,INTERNATIONAL BUSINESS MACHINES CORPORATION,RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: SG Singapore US NY New York JP
- Agency: Horizon IP Pte. Ltd.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F7/06 ; G06F1/00 ; H01L29/66
Abstract:
Multi-Project Wafers includes a plurality of chiplets from different IP owners. Non-relevant chiplets are implemented with IP protection to inhibit IP disclosure of non-relevant IP owners.
Public/Granted literature
- US20120319246A1 IP PROTECTION Public/Granted day:2012-12-20
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