Invention Grant
- Patent Title: Power module for envelope tracking
- Patent Title (中): 用于信封跟踪的电源模块
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Application No.: US14336137Application Date: 2014-07-21
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Publication No.: US09071200B2Publication Date: 2015-06-30
- Inventor: Chun-Yen Tseng , Yen-Hsun Hsu
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H03G3/20
- IPC: H03G3/20 ; H03F3/04 ; H03F3/195 ; H03F1/02 ; H03F3/21

Abstract:
A power module at least includes an ET (Envelope Tracking) module. The ET module includes a buck converter, an inductor, and a capacitor. The buck converter is coupled to a work voltage. The buck converter has a first input terminal for receiving a first control signal, a second input terminal coupled to a supply node, and a buck output terminal The inductor is coupled between the buck output terminal of the buck converter and the supply node. The capacitor is coupled between the supply node and a ground voltage. The ET module is configured to supply a first adaptive supply voltage at the supply node. The first adaptive supply voltage is determined according to the first control signal.
Public/Granted literature
- US20140327485A1 POWER MODULE FOR ENVELOPE TRACKING Public/Granted day:2014-11-06
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