Invention Grant
- Patent Title: Multi-array ultrasonic probe apparatus and method for manufacturing multi-array probe apparatus
- Patent Title (中): 多阵列超声波探头装置及其制造方法
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Application No.: US13741907Application Date: 2013-01-15
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Publication No.: US09071893B2Publication Date: 2015-06-30
- Inventor: Young-Il Kim , Dong Wook Kim , Bae Hyung Kim , Jong Keun Song , Seung Heun Lee , Kyung Il Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0026098 20120314
- Main IPC: H04R1/00
- IPC: H04R1/00 ; G10K11/00 ; H04R31/00 ; B06B1/02

Abstract:
A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.
Public/Granted literature
- US20130242705A1 MULTI-ARRAY ULTRASONIC PROBE APPARATUS AND METHOD FOR MANUFACTURING MULTI-ARRAY PROBE APPARATUS Public/Granted day:2013-09-19
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