发明授权
US09072207B2 Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit
有权
具有电路的悬架板及其制造方法以及具有电路的悬挂板的定位方法
- 专利标题： Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit
- 专利标题（中）： 具有电路的悬架板及其制造方法以及具有电路的悬挂板的定位方法
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申请号： US12458996申请日： 2009-07-29
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公开(公告)号： US09072207B2公开(公告)日： 2015-06-30
- 发明人: Yasunari Ooyabu , Tetsuya Ohsawa , Emiko Tani
- 申请人： Yasunari Ooyabu , Tetsuya Ohsawa , Emiko Tani
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 代理机构： Edwards Neils PLLC
- 代理商 Jean C. Edwards, Esq.
- 优先权： JP2008-202666 20080806
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K1/11 ; G11B5/48 ; G11B21/16 ; H05K3/40 ; H05K1/02 ; H05K1/05 ; H05K3/00
摘要：
A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
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