Invention Grant
US09075081B2 Method and means for coupling high-frequency energy to and/or from the nanoscale junction of an electrically-conductive tip with a semiconductor 有权
将高频能量耦合到和/或从导电尖端与半导体的纳米级结结合的方法和装置

  • Patent Title: Method and means for coupling high-frequency energy to and/or from the nanoscale junction of an electrically-conductive tip with a semiconductor
  • Patent Title (中): 将高频能量耦合到和/或从导电尖端与半导体的纳米级结结合的方法和装置
  • Application No.: US14223727
    Application Date: 2014-03-24
  • Publication No.: US09075081B2
    Publication Date: 2015-07-07
  • Inventor: Mark J. Hagmann
  • Applicant: Mark J. Hagmann
  • Agency: Dobbin IP Law P.C.
  • Agent Geoffrey E. Dobbin
  • Main IPC: G01Q30/20
  • IPC: G01Q30/20 G01Q60/16 G01Q60/10 G01Q60/00
Method and means for coupling high-frequency energy to and/or from the nanoscale junction of an electrically-conductive tip with a semiconductor
Abstract:
A method for coupling high-frequency energy, in particular for microwave circuits, to a nanoscale junction involves placing a bias-T outside of the tip and sample circuits of a scanning probe microscope and connecting a portion of a sample of analyzed semi-conductor through an outer shielding layer of coaxial cable so as to complete a circuit with minimal involvement of the sample. The bias-T branches into high and low-frequency circuits, both of which are completed and, at least the high-frequency circuit, does not rely on grounding of implements or other structure to accomplish said completion.
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