发明授权
- 专利标题: Chip thermistor and thermistor assembly board
- 专利标题(中): 片式热敏电阻和热敏电阻组合板
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申请号: US13884390申请日: 2011-10-18
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公开(公告)号: US09076576B2公开(公告)日: 2015-07-07
- 发明人: Yo Saito , Kouki Yamada , Yukihiro Murakami
- 申请人: Yo Saito , Kouki Yamada , Yukihiro Murakami
- 申请人地址: JP Tokyo
- 专利权人: TDK CORPORATION
- 当前专利权人: TDK CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JP2010-260187 20101122
- 国际申请: PCT/JP2011/073962 WO 20111018
- 国际公布: WO2012/070336 WO 20120531
- 主分类号: H01C7/10
- IPC分类号: H01C7/10 ; H01C7/00 ; H01C7/02 ; H01C7/04
摘要:
A chip thermistor is provided with a thermistor element body, a first electrode, a second electrode, and a third electrode. The thermistor element body has a first principal face and a second principal face opposed to each other in a first direction. The first electrode and the second electrode are arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body. The third electrode is arranged so as to lap over the first electrode and the second electrode, when viewed from the first direction, on the second principal face of the thermistor element body.
公开/授权文献
- US20130222106A1 CHIP THERMISTOR AND THERMISTOR ASSEMBLY BOARD 公开/授权日:2013-08-29
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