Invention Grant
- Patent Title: Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure
- Patent Title (中): 晶片支撑结构，包括晶片支撑结构的半导体封装的中间结构
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Application No.: US14147051Application Date: 2014-01-03
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Publication No.: US09076701B2Publication Date: 2015-07-07
- Inventor: Jun-Won Han , Jae-Hyun Kim , Tae-Hoon Kim , Ho-Geun Lee , You-Jeong Jeong , Jung-Sik Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0000484 20130103
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L23/00 ; B32B7/06 ; H01L21/683
Abstract:
A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.
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