发明授权
- 专利标题： Method of bonding a semiconductor device using a compliant bonding structure
- 专利标题（中）： 使用柔性接合结构接合半导体器件的方法
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申请号： US13470784申请日： 2012-05-14
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公开(公告)号： US09076944B2公开(公告)日： 2015-07-07
- 发明人: James G. Neff , John E. Epler , Stefano Schiaffino
- 申请人： James G. Neff , John E. Epler , Stefano Schiaffino
- 申请人地址： NL Eindhoven
- 专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人地址： NL Eindhoven
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L33/62 ; H01L33/38 ; H01L33/00
摘要：
A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.
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