Invention Grant
- Patent Title: Saw array sensor
- Patent Title (中): 锯阵列传感器
-
Application No.: US13743152Application Date: 2013-01-16
-
Publication No.: US09076956B2Publication Date: 2015-07-07
- Inventor: Yeol-ho Lee , Youn-suk Choi , Tae-han Lee , Soo-suk Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: KR10-2012-0069475 20120627
- Main IPC: H03H9/42
- IPC: H03H9/42 ; H01L41/047 ; H03H9/145 ; G01N29/02 ; G01N29/32

Abstract:
A surface acoustic wave (SAW) array sensor having an input interdigital transducer (IDT); first and second output IDTs that are disposed at both sides of the input IDT, respectively; a first delay line between the input IDT and the first output IDT; and a second delay line between the input IDT and the second output IDT, wherein the first and second delay lines have different lengths; and related devices.
Public/Granted literature
- US20140001918A1 SAW ARRAY SENSOR Public/Granted day:2014-01-02
Information query