Invention Grant
- Patent Title: Power relaying apparatus, power transmission system and method for manufacturing power relaying apparatus
- Patent Title (中): 电力中继装置,动力传动系统及其制造方法
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Application No.: US13178589Application Date: 2011-07-08
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Publication No.: US09077193B2Publication Date: 2015-07-07
- Inventor: Yoichi Uramoto , Takashi Narikiyo
- Applicant: Yoichi Uramoto , Takashi Narikiyo
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2010-160412 20100715
- Main IPC: H01F27/42
- IPC: H01F27/42 ; H01F37/00 ; H01F38/00 ; H02J5/00

Abstract:
Disclosed herein is a power relaying apparatus provided between: a power supplying apparatus including a power supplying resonance device and a power supplying power supply section for supplying an AC current to the power supplying resonance device; and a power receiving apparatus having a power receiving resonance device for receiving a power from the power supplying apparatus by adoption of a resonance method, the power relaying apparatus including a power relaying resonance device resonating between the power supplying resonance device and the power receiving resonance device, wherein the power relaying resonance device is fixed at a predetermined position by making use of an insulation member.
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