发明授权
- 专利标题: High-frequency module
- 专利标题(中): 高频模块
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申请号: US13782026申请日: 2013-03-01
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公开(公告)号: US09077439B2公开(公告)日: 2015-07-07
- 发明人: Takanori Uejima
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2010-218065 20100929
- 主分类号: H04B1/48
- IPC分类号: H04B1/48 ; H03H7/46 ; H04B1/00
摘要:
A small high-frequency module has a structure such that a high-power signal is prevented from leaking to a switch device. On the top surface of a multilayer body, a switch device and a duplexer are mounted so as to be spaced apart from each other by a predetermined distance. An inductor and resistors connected to a circuit different from a transmission system circuit are mounted between the switch device and the duplexer. The inductor and the resistors are mounted such that external connection terminals connected to the switch device are on the switch device side and external connection terminals connected to external connection power system port electrodes of the high-frequency module are on the duplexer side.
公开/授权文献
- US20130176916A1 HIGH-FREQUENCY MODULE 公开/授权日:2013-07-11
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