Invention Grant
- Patent Title: Assembly, component for an assembly and method of manufacturing an assembly
- Patent Title (中): 组件,组件组件和制造组件的方法
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Application No.: US13575036Application Date: 2011-01-31
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Publication No.: US09078361B2Publication Date: 2015-07-07
- Inventor: Gerardus Titus Van Heck , Margaretha Maria De Kok , Jeroen Van Den Brand
- Applicant: Gerardus Titus Van Heck , Margaretha Maria De Kok , Jeroen Van Den Brand
- Applicant Address: NL Delft
- Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Current Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Current Assignee Address: NL Delft
- Agency: Banner & Witcoff, Ltd.
- Priority: EP10152129 20100129
- International Application: PCT/NL2011/050064 WO 20110131
- International Announcement: WO2011/093713 WO 20110804
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L27/32 ; H01L51/52 ; H01R4/70 ; H05K3/36 ; H05B33/08 ; H05B33/10 ; H05K13/04 ; H01L31/0392 ; H01L31/042 ; G09F9/00 ; G09F19/22 ; H01R4/04 ; H01R12/70 ; H05K1/03 ; H05K1/14 ; H05K1/18 ; H05K3/32

Abstract:
An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.
Public/Granted literature
- US20130200783A1 ASSEMBLY, COMPONENT FOR AN ASSEMBLY AND METHOD OF MANUFACTURING AN ASSEMBLY Public/Granted day:2013-08-08
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