The present invention provides a wiring board wherein the resistance difference between multiple connection lines is reduced. The wiring board of the present invention comprises: a control region and a peripheral region. The control region includes multiple gate lines extending in a row direction and multiple source lines extending in a column direction. The peripheral region includes a gate driver connected with the gate lines; a source driver connected with the source lines; and multiple connection lines which extend around the control region and which connect the gate driver with the gate lines. Each of the connection lines includes a gate metal portion formed from a material of the gate lines and a source metal portion formed from a material of the source lines. An insulating layer is disposed between the gate metal portion and the source metal portion. The gate metal portion and the source metal portion are connected with each other via a contact portion which penetrates the insulating layer.