发明授权
- 专利标题: Component mounting method and component mounting apparatus
- 专利标题(中): 部件安装方法和部件安装装置
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申请号: US13203841申请日: 2010-12-28
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公开(公告)号: US09078385B2公开(公告)日: 2015-07-07
- 发明人: Kazuo Kido , Kenichi Kaida
- 申请人: Kazuo Kido , Kenichi Kaida
- 申请人地址: JP Osaka
- 专利权人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址: JP Osaka
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2010-009436 20100119
- 国际申请: PCT/JP2010/007585 WO 20101228
- 国际公布: WO2011/089681 WO 20110728
- 主分类号: H05K3/30
- IPC分类号: H05K3/30 ; B23P19/00 ; H05K13/00
摘要:
A component mounting method of mounting a component onto a board by a component mounting apparatus which includes a transportation device having a plurality of rails capable of transporting a plurality of boards in parallel is provided. The method includes positioning the rails so that a center of a mounting area in a forward-backward direction is at an intermediate position between corresponding parts of two component supply units, the mounting area covering an area in which two mounting heads mount components on one or more of the boards which are transported by the transportation device, and the intermediate position being equally distant in the forward-backward direction from the two component supply units; and alternately mounting the components in the mounting area between the two mounting heads.
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