Invention Grant
US09079392B2 Double sided flex for improved bump interconnect 有权
双面弯曲,改善凸块互连

Double sided flex for improved bump interconnect
Abstract:
A printhead including a plurality of embossed first flex circuit pads and a first plurality of first active traces on a first side of a dielectric substrate, and a plurality of embossed second flex circuit pads on a second side of the dielectric substrate. The plurality of embossed first flex circuit pads are configured to be electrically active as part of an electric circuit during operation of the printhead, while the plurality of embossed second flex circuit pads may be configured to be electrically active or electrically inactive during operation of the printhead.
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