Invention Grant
- Patent Title: Double sided flex for improved bump interconnect
- Patent Title (中): 双面弯曲,改善凸块互连
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Application No.: US14038108Application Date: 2013-09-26
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Publication No.: US09079392B2Publication Date: 2015-07-14
- Inventor: Peter J. Nystrom
- Applicant: XEROX CORPORATION
- Applicant Address: US CT Norwalk
- Assignee: XEROX CORPORATION
- Current Assignee: XEROX CORPORATION
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/045

Abstract:
A printhead including a plurality of embossed first flex circuit pads and a first plurality of first active traces on a first side of a dielectric substrate, and a plurality of embossed second flex circuit pads on a second side of the dielectric substrate. The plurality of embossed first flex circuit pads are configured to be electrically active as part of an electric circuit during operation of the printhead, while the plurality of embossed second flex circuit pads may be configured to be electrically active or electrically inactive during operation of the printhead.
Public/Granted literature
- US20150085019A1 DOUBLE SIDED FLEX FOR IMPROVED BUMP INTERCONNECT Public/Granted day:2015-03-26
Information query
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