Invention Grant
- Patent Title: Low latency interconnect bus protocol
- Patent Title (中): 低延迟互联总线协议
-
Application No.: US13858447Application Date: 2013-04-08
-
Publication No.: US09081905B2Publication Date: 2015-07-14
- Inventor: Gal Basson , Tal Azogui
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04J3/16
- IPC: H04J3/16 ; G06F13/38 ; H04L29/06 ; H04W76/02
Abstract:
A method for enabling a low latency medium access control for an interconnect bus protocol over a wireless medium is provided. The method comprises constructing a wireless medium access control (WMAC) frame, wherein the WMAC frame includes a plurality of medium access control service data units (MSDUs) being aggregated according to their transmission order, the MSDUs include transaction layer packets generated by a component of the interconnect bus, wherein transmission of the WMAC frame over the wireless medium provides any one of an implied acknowledgment (ACK) mechanism and a block ACK mechanism.
Public/Granted literature
- US20130227184A1 LOW LATENCY INTERCONNECT BUS PROTOCOL Public/Granted day:2013-08-29
Information query
