Invention Grant
- Patent Title: Method and apparatus for node hot-swapping
- Patent Title (中): 节点热插拔的方法和装置
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Application No.: US13683861Application Date: 2012-11-21
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Publication No.: US09081912B2Publication Date: 2015-07-14
- Inventor: Yixiang Liao , Dengben Wu , Yu Zhang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Brinks Gilson & Lione
- Priority: CN201110378843 20111124
- Main IPC: G06F13/40
- IPC: G06F13/40 ; H04L12/24 ; G06F13/00

Abstract:
The present invention discloses a method and an apparatus for node hot-swapping, which simplify the node hot-adding procedure, and improve the operation efficiency of the hot-adding procedure. The present invention includes: obtaining, by a server from a baseboard management controller BMC of a node device to be added, static hardware information of the node device to be added, and storing it into a storage device of the server, where the static hardware information is obtained through an out-band channel by the BMC of the node device to be added; receiving, by the server, a node hot-adding command sent by a user, where the hot-adding command carries identifier information of the node device to be added; obtaining the static hardware information of the node device to be added corresponding to the identifier information from the storage device; and adding, according to the static hardware information, the node device to be added.
Public/Granted literature
- US20130138856A1 METHOD AND APPARATUS FOR NODE HOT-SWAPPING Public/Granted day:2013-05-30
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