Invention Grant
- Patent Title: Method of controlling threshold voltage and method of fabricating semiconductor device
- Patent Title (中): 控制阈值电压的方法和制造半导体器件的方法
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Application No.: US13965600Application Date: 2013-08-13
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Publication No.: US09082660B2Publication Date: 2015-07-14
- Inventor: Ji Feng , Hai-Long Gu , Ying-Tu Chen
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01L21/762

Abstract:
A method of controlling a threshold voltage is provided. The method of controlling a threshold voltage includes performing a film-thickness measuring step to measure the thickness of a film layer on a wafer to obtain a film-thickness value. Then, at least one parameter is decided, selected, or generated according to the film-thickness value. Next, an ion implantation process is performed on the wafer, wherein the ion implantation process is executed according to the parameter to form a threshold voltage adjustment region in the wafer below the film layer.
Public/Granted literature
- US20150050751A1 METHOD OF CONTROLLING THRESHOLD VOLTAGE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2015-02-19
Information query
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