发明授权
- 专利标题： Chip packaging substrate and chip packaging structure
- 专利标题（中）： 芯片封装基板和芯片封装结构
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申请号： US13849294申请日： 2013-03-22
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公开(公告)号： US09082710B2公开(公告)日： 2015-07-14
- 发明人: Ying-Tai Tang
- 申请人： ChipMOS Technologies, Inc.
- 代理机构： Foster Pepper PLLC
- 代理商 Richard C. Vershave
- 优先权： TW101110027A 20120323
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L21/66 ; H01L23/498
摘要：
A chip packaging substrate includes a flexible substrate, a plurality of test pads, and a plurality of leads, wherein the flexible substrate has a first surface and a second surface, and the first surface has a user area and a test pad area configured thereon. The test pads are arranged in at least three rows within the test pad area. The lead connected to the test pad in the middle row includes a first section extending from the chip to the test pad area and a second section disposed on the second surface, wherein one end of the second section penetrates the flexible substrate to connect with the first section and the other end penetrates the flexible substrate to connect with the test pad, so as to increase the dimensions of the test pads.
公开/授权文献
- US20130248863A1 CHIP PACKAGING SUBSTRATE AND CHIP PACKAGING STRUCTURE 公开/授权日：2013-09-26
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