Invention Grant
- Patent Title: Semiconductor device having buried channel array
- Patent Title (中): 具有埋入通道阵列的半导体器件
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Application No.: US13959765Application Date: 2013-08-06
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Publication No.: US09082850B2Publication Date: 2015-07-14
- Inventor: Na-Ra Kim , Seung-Hwan Kim , Sung-Hee Lee , Dae-Sin Kim , Ji-Young Kim , Dong-Soo Woo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2012-0118562 20121024
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L27/108 ; H01L29/423 ; H01L21/762

Abstract:
A semiconductor device includes a field regions in a substrate to define active regions, gate trenches including active trenches disposed across the active region and field trenches in the field regions, and word lines that fill the gate trenches and extend in a first direction. The word lines include active gate electrodes occupying the active trenches, and field gate electrodes occupying the field trenches. The bottom surface of each field gate electrode, which is disposed between active regions that are adjacent to each other and have one word line therebetween, is disposed at a higher level than the bottom surfaces of the active gate electrodes.
Public/Granted literature
- US20140110786A1 SEMICONDUCTOR DEVICE HAVING BURIED CHANNEL ARRAY Public/Granted day:2014-04-24
Information query
IPC分类: