Invention Grant
- Patent Title: Internal cut-through for distributed switches
- Patent Title (中): 分布式开关的内部直通
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Application No.: US13803918Application Date: 2013-03-14
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Publication No.: US09083655B2Publication Date: 2015-07-14
- Inventor: William Brad Matthews , Puneet Agarwal , Bruce Hui Kwan
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Brinks Gilson & Lione
- Main IPC: H04L12/26
- IPC: H04L12/26 ; H04L12/741

Abstract:
Processing techniques in a network switch help reduce latency in the delivery of data packets to a recipient. The processing techniques include internal cut-through. The internal cut-through may bypass input port buffers by directly forwarding packet data that has been received to an output port. At the output port, the packet data is buffered for processing and communication out of the switch.
Public/Granted literature
- US20140098818A1 Internal Cut-Through For Distributed Switches Public/Granted day:2014-04-10
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