Invention Grant
US09083960B2 Real-time 3D reconstruction with power efficient depth sensor usage
有权
实时3D重建,功能高效的深度传感器使用
- Patent Title: Real-time 3D reconstruction with power efficient depth sensor usage
- Patent Title (中): 实时3D重建,功能高效的深度传感器使用
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Application No.: US14161140Application Date: 2014-01-22
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Publication No.: US09083960B2Publication Date: 2015-07-14
- Inventor: Daniel Wagner , Alessandro Mulloni
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Silicon Valley Patent Group LLP
- Main IPC: H04N13/02
- IPC: H04N13/02 ; H04N15/00 ; G06T17/00

Abstract:
Embodiments disclosed facilitate resource utilization efficiencies in Mobile Stations (MS) during 3D reconstruction. In some embodiments, camera pose information for a first color image captured by a camera on an MS may be obtained and a determination may be made whether to extend or update a first 3-Dimensional (3D) model of an environment being modeled by the MS based, in part, on the first color image and associated camera pose information. The depth sensor, which provides depth information for images captured by the camera, may be disabled, when the first 3D model is not extended or updated.
Public/Granted literature
- US20140139639A1 REAL-TIME 3D RECONSTRUCTION WITH POWER EFFICIENT DEPTH SENSOR USAGE Public/Granted day:2014-05-22
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