Invention Grant
- Patent Title: Backlight module, printed circuit board used for backlight module, and manufacturing method for the same
- Patent Title (中): 背光模块,用于背光模块的印刷电路板及其制造方法
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Application No.: US13811279Application Date: 2013-01-11
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Publication No.: US09084345B2Publication Date: 2015-07-14
- Inventor: Che-chang Hu , Kuang-Yao Chang , Qian Cao
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- International Application: PCT/CN2013/070390 WO 20130111
- International Announcement: WO2014/107891 WO 20140717
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G02F1/1335 ; H05K1/05

Abstract:
The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board.
Public/Granted literature
- US20140192514A1 Backlight Module, Printed Circuit Board Used for Backlight Module, and Manufacturing Method for The Same Public/Granted day:2014-07-10
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